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Books by John H. Lau

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3D IC Integration and Packaging
🇺🇸 United States
3D IC Integration and Packaging
By: John H. Lau
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
🇬🇧 United Kingdom
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (E…
By: John H. Lau
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
🇫🇷 France
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By: John H. Lau
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
🇩🇪 Germany
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (E…
By: John H. Lau
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
🇺🇸 United States
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA As…
By: John H. Lau
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Ball Grid Array Technology
🇺🇸 United States
Ball Grid Array Technology
By: John H. Lau
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronics)
🇮🇳 India
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (E…
By: John H. Lau
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Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies (McGraw-Hill Professional Engineering)
🇩🇪 Germany
Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga As…
By: John H. Lau
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Ball Grid Array Technology (Electronic Packaging & Interconnection Series)
🇩🇪 Germany
Ball Grid Array Technology (Electronic Packaging & Inte…
By: John H. Lau
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Solder Joint Reliability: Theory and Applications
🇺🇸 United States
Solder Joint Reliability: Theory and Applications
By: John H. Lau
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
🇺🇸 United States
Chip On Board: Technology for Multichip Modules (E; Ectrica…
By: John H. Lau
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Handbook of Fine Pitch Surface Mount Technology (Electrical Engineering)
🇺🇸 United States
Handbook of Fine Pitch Surface Mount Technology (Electrical…
By: John H. Lau
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Handbook Of Tape Automated Bonding
🇺🇸 United States
Handbook Of Tape Automated Bonding
By: John H. Lau
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