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Total process control and management, part II: from reliability, stability and traceability to predictability.(Process Control): An article from: Circuits Assembly
🇺🇸 United States
Total process control and management, part II: from reliabi…
By: Paul P.E. Wang, Jorge Martinez-Vargas, Dinesh Gill, Ramamoorthy Ganapathy Iyer, Dan Kauss
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Validating press-fit connector installation: a winning combination: press-fit technology and installation by PC-controlled servo-electric presses.(Connectors): An article from: Circuits Assembly
🇺🇸 United States
Validating press-fit connector installation: a winning comb…
By: Dante Parenti, Jack Mitchell
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PCB design for defect-free selective soldering General guidelines for SnPb and Pb-free alloys.(SELECTIVE SOLDERING): An article from: Printed Circuit Design & Fab
🇺🇸 United States
PCB design for defect-free selective soldering General guid…
By: Unavailable
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Preparing for the WEEE Directive: recycling requirements for equipment sold in the EU go into effect Aug. 13. A primer on getting ready.(Countdown to Pb-Free): An article from: Circuits Assembly
🇺🇸 United States
Preparing for the WEEE Directive: recycling requirements fo…
By: Kenneth S. Rivlin, Jean-Philippe Brisson, David Wharwood
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AOI--defining reliability for complex designs: advanced AOI techniques provide manufacturers and OEM customers with exceptional inspection ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
AOI--defining reliability for complex designs: advanced AOI…
By: Zulki Kahn
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Q&A with Nicholas Brathwaite, chief technology officer, Flextronics Corp.(The Fine Pitch): An article from: Circuits Assembly
🇺🇸 United States
Q&A with Nicholas Brathwaite, chief technology officer,…
By: Lisa Hamburg Bastin
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The return of the brainteaser interview: puzzles that challenge your logical thinking are back. Correct answers may not be required.(Career Care): An article from: Printed Circuit Design & Manufacture
🇺🇸 United States
The return of the brainteaser interview: puzzles that chall…
By: Ted Daywalt
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RCC Capacitive layers for SBU applications: thin-film polymer nanocomposite capacitors can achieve high-capacitance density over large areas, reduce ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
RCC Capacitive layers for SBU applications: thin-film polym…
By: Rabindra N. Das, Steven G. Rosser, Konstantinos I. Papathomas, Mark D. Poliks, John M. Lauffer, Voya R. Markovich
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PCB signal integrity, power integrity and EMC challenges: system-level PCB emissions analysis reduces re-spins and EMC issues when PCBs are ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
PCB signal integrity, power integrity and EMC challenges: s…
By: Brad Brim
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Even small things count! Readers with questions concerning 0201 components and ceramic capacitors are given some helpful advice.(Ask Les): An article from: Circuits Assembly
🇺🇸 United States
Even small things count! Readers with questions concerning …
By: Les Hymes
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IC package to PCB co-design: advances in IC packages provide designers with pin assignment control that reduces routing time, improves signal ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
IC package to PCB co-design: advances in IC packages provid…
By: Benjamin Jordan
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All solder pastes are not created equal: several in-house tests will reveal if you are using the right solder paste for your application.(Materials): An article from: Circuits Assembly
🇺🇸 United States
All solder pastes are not created equal: several in-house t…
By: Phil Zarrow
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NEMI Project: free model compares costs of test strategies.(Industry News)(National Electronics Manufacturing Initiative): An article from: Circuits Assembly
🇺🇸 United States
NEMI Project: free model compares costs of test strategies.…
By:
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Improved electrolytic COPPER PLATING for Flex PWBs; a novel process is said to improve product interconnection and mechanical reliability.(COPPER ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
Improved electrolytic COPPER PLATING for Flex PWBs; a novel…
By: Hiroshi Hoshiyama, Shinjiroh Hayashi, Makoto Sakai, Rikiya Shimizu
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When tactics win out: the supply chain works best when diligence and consistency rule the relationships.(GLOBAL SOURCING): An article from: Circuits Assembly
🇺🇸 United States
When tactics win out: the supply chain works best when dili…
By: Charlie Barnhart
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RF and PCB design: RF conductors form actual circuit components, a major difference from signal or static power voltage traces.(DESIGNER'S NOTEBOOK): An article from: Printed Circuit Design & Fab
🇺🇸 United States
RF and PCB design: RF conductors form actual circuit compon…
By: Mark Forbes
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Choosing a BGA inspection system: a review of three types of nondestructive equipment: 2-D x-ray, endoscopic and 3-D x-ray.(Soldering Tips): An article from: Circuits Assembly
🇺🇸 United States
Choosing a BGA inspection system: a review of three types o…
By:
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Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
Copper plating and microvia fill for advanced PCBS: vertica…
By: Bruce Chen
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The effect of placement yield on rework costs: a benchmark study of cost as a function of various yield rates and line capacity.(COMPONENT PLACEMENT): An article from: Printed Circuit Design & Fab
🇺🇸 United States
The effect of placement yield on rework costs: a benchmark …
By: Sjef Van Gastel
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Certifying the SMT process engineer.(Surface Mount Technology ): An article from: Circuits Assembly
🇺🇸 United States
Certifying the SMT process engineer.(Surface Mount Technolo…
By: Phil Zarrow
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ESD Control in Handling and Sorting -- Even minor, and seemingly unimportant, actions can produce ESD. Read on to ensure that your actions aren't the ... Article): An article from: Circuits Assembly
🇺🇸 United States
ESD Control in Handling and Sorting -- Even minor, and seem…
By: Michael T. Brandt
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Using a printer in chip attachment and encapsulation: part two of a look at how traditional SMT processes address semiconductor packaging.(Screen Printing): An article from: Circuits Assembly
🇺🇸 United States
Using a printer in chip attachment and encapsulation: part …
By: Clive Ashmore
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Paralleling capacitors: differences in maximum ripple current and ESR can lead to a shift in the ripple current--and premature failure.(POWER SUPPLY ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
Paralleling capacitors: differences in maximum ripple curre…
By: Mark Woolley, Jae Choi
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Optimizing Pb-free SMT process parameters: a Taguchi approach reveals the most important process steps and best settings for screen-printing and ... Story): An article from: Circuits Assembly
🇺🇸 United States
Optimizing Pb-free SMT process parameters: a Taguchi approa…
By: Antonio Buonomo, Alessandro Lo Schiavo, Fabrizio Rotulo
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What role do Vias play in DfA? Proper pad-to-via clearance can improve solder joint strength.(DESIGNER'S NOTEBOOK): An article from: Printed Circuit Design & Fab Circuits Assembly
🇺🇸 United States
What role do Vias play in DfA? Proper pad-to-via clearance …
By: W. Scott Fillebrown
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Printable nanocomposites: advanced materials provide a low cost and highly versatile method for manufacturing flexible electronic circuits.(NANOTECH): An article from: Printed Circuit Design & Fab
🇺🇸 United States
Printable nanocomposites: advanced materials provide a low …
By: Rabindra N. Das, How Lin, John M. Lauffer, Michael Rowlands, Norman Card, Voya R. Markovich
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Playing the collective hand: ECTC attendees search for winning solutions in Las Vegas.(ON THE FOREFRONT): An article from: Printed Circuit Design & Fab
🇺🇸 United States
Playing the collective hand: ECTC attendees search for winn…
By: E. Jan Vardaman
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Board-on-chip toolset ready: Altium to roll out Nexar this quarter.(Design): An article from: Printed Circuit Design & Manufacture
🇺🇸 United States
Board-on-chip toolset ready: Altium to roll out Nexar this …
By: Mike Buetow
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Automating the DDRx-interface verification process: today's standard interfaces are more complex so that both timing and signal integrity need to be a ... An article from: Printed Circuit Design & Fab
🇺🇸 United States
Automating the DDRx-interface verification process: today&#…
By: Dave Kohlmeier
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Making the 'centigrade': how Motorola tested--and approved--a lead-free solder paste.(Cover Story): An article from: Circuits Assembly
🇺🇸 United States
Making the 'centigrade': how Motorola tested--and…
By: Vahid Goudarzi, Grahame Freeman
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VAR breathes new life into OrCad Line.(EMA Renews Investment, Demand): An article from: Printed Circuit Design & Manufacture
🇺🇸 United States
VAR breathes new life into OrCad Line.(EMA Renews Investmen…
By: Mike Buetow
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3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly
🇺🇸 United States
3-D IC bonding: supply-chain roles are changing, with EMS f…
By: Chris Sanders
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