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UP Media Group, Inc.
Books by Publisher: UP Media Group, Inc.
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438
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🇺🇸 United States
Considerations for implementing lead-free soldering: smalle…
By:
Mark Cannon
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🇺🇸 United States
PCI Express verification: with the right game plan, microwa…
By:
Randy Weber
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🇺🇸 United States
Bad fit customers: when should EMS providers say good-bye?(…
By:
Susan Mucha
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🇺🇸 United States
High thermal mass, very high lead count SMT connector rewor…
By:
Jim Bielick, Brian Chapman, Mitchell Ferrill, Michael Fisher, Phil Isaacs, Eddie Kobeda, Theron Lewis
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🇺🇸 United States
Drilling to the source of voids: even optimized plating can…
By:
Michael Carano
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🇺🇸 United States
Best practices in contract manufacturing: though different …
By:
Randall Sherman, Dave Leone, Frank Klomp
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🇺🇸 United States
Echoes of bits past: reflection noise is the most common so…
By:
Eric Bogatin
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🇺🇸 United States
Repeatable FPGA-on-board optimization: simply recreating th…
By:
Frank Smetana
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🇺🇸 United States
Will discoloration tarnish ImAg reliability? Watch for silv…
By:
Gale Reference Team
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🇺🇸 United States
September fall for production.(MARKET WATCH): An article fr…
By:
Gale Reference Team
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🇺🇸 United States
Making the most of ESD standards: standards can be importan…
By:
Michael T. Brandt
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🇺🇸 United States
An on-board mass calibration system for liquid encapsulatio…
By:
Thomas Karlinski
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🇺🇸 United States
The IPC-B-52 sir test vehicle: current test vehicle design …
By:
Mitchell Ferrill, Matt Kelly, Wai Ma, Nandu Ranadive, Cheikhou Ndiaye, Jim Bielick, Simin Bagheri
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🇺🇸 United States
Product development is more than PCB: To ignore the enclosu…
By:
Unavailable
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🇺🇸 United States
3D chip-package-board modeling: advanced computing language…
By:
Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Feng Ling, Xiren Wang, Devan Williams, James Pingenot
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🇺🇸 United States
A year of transition: many design professionals are still d…
By:
Andy Shaughnessy
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🇺🇸 United States
Die skewing: due to the continued growth of flip-chip techn…
By:
S. Craig Beddingfield, Brian Lewis
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🇺🇸 United States
Hand solder rework of Pb-free PTH and SMT packages: some pa…
By:
Alan Donaldson
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🇺🇸 United States
Plating high aspect ratio PCBs: achieving proper copper dep…
By:
Stephen Kenny, Bert Reents, Jens Zosel
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🇺🇸 United States
When it comes to CAD, function beats speed: a recent survey…
By:
Chelsey Drysdale
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🇺🇸 United States
PCB Burlesque: Stripping Away Solder Mask -- Several safe a…
By:
Jeff Ferry
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🇺🇸 United States
Mastering the dark art of screen printing: simultaneous vis…
By:
Matthew Dickinson
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🇺🇸 United States
Imbedded Component/Die Technology: increased reliability--c…
By:
Jim Raby, Mark McMeen, Jason Gjesvold, Casey Hatcher
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🇺🇸 United States
A novel Six Sigma SnPb solder paste: a new platform employe…
By:
Derrick Moyer, Steve Ratner, Martin Lopez, John McMaster, Frank Murch, Mike Skrzat
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🇺🇸 United States
Ensuring reproducibility in selective soldering: quality to…
By:
Gerjan Diepstraten, Gert Schouten
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🇺🇸 United States
Die Bonding in an Optoelectronic World -- PCB assemblers ve…
By:
Don Moore
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🇺🇸 United States
5 tips for reducing EMI: even the best high-speed design pl…
By:
Eric Bogatin
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🇺🇸 United States
An alternative PCB architecture for high-speed chip-to-chip…
By:
Joseph Fjelstad
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🇺🇸 United States
Achieving design collaboration: driving design intent throu…
By:
Pawel Chadzynski
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🇺🇸 United States
Why pride and outsourcing don't mix; Root problems ten…
By:
Gale Reference Team
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🇺🇸 United States
Optimizing stencil design for Pb-free SMT: in quantifying t…
By:
Ranjit S. Pandher, Chrys Shea
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🇺🇸 United States
Current and conductors: the answers to all the age-old ques…
By:
Michael Jouppi
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