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UP Media Group, Inc.
Books by Publisher: UP Media Group, Inc.
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438
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🇺🇸 United States
Managing the EMS value chain: to succeed in today's ma…
By:
Mike Fargo
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🇺🇸 United States
A strategic approach to automating photonics manufacturing:…
By:
Joe Campbell
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🇺🇸 United States
MEMS for mobile communications: microelectromechanical (MEM…
By:
Vladimir Ermolov, Heikki Nieminen, Kjell Nybergh, Tapani Ryhanen, Samuli Silanto
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🇺🇸 United States
A solar cell primer for the PCB industry: manufacturing met…
By:
Don Cullen
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🇺🇸 United States
Tackling the copper wrap plate requirement: wrap plating im…
By:
Rajwant Sidhu
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🇺🇸 United States
Toshiba America Consumer Products' plant celebrates 25…
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🇺🇸 United States
Flip chip packaging: a hot topic: flip chip technology appe…
By:
E. Jan Vardaman
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🇺🇸 United States
Are lead-free solder joints reliable? Judge for Yourself. A…
By:
John E. Sohn
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🇺🇸 United States
MLF assembly challenges: high-yield MLF assembly is possibl…
By:
George Westby
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🇺🇸 United States
Hiring a sales manager: first, decide what you need a sales…
By:
Dan Beaulieu
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🇺🇸 United States
Changeover control: understanding capabilities and managing…
By:
Richard Boulanger, Shawn Robinson
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🇺🇸 United States
The value of IPC-2152: for the first time, conductor sizing…
By:
Michael R. Jouppi
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🇺🇸 United States
Controlling and avoiding ESD.(Ten Timely Tips): An article …
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🇺🇸 United States
Managing your ESD program: implementing an ESD control prog…
By:
Michael T. Brandt
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🇺🇸 United States
The future of R&D: in the area of basic research, who w…
By:
Gale Reference Team
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🇺🇸 United States
Installing flash LEDs on flex: flex can save up to 70% in s…
By:
Shereen Lim
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🇺🇸 United States
EMS' rude awakening: can high-mix, low-volume producti…
By:
Carl Hung
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🇺🇸 United States
A supply-chain engineering solution: how "clusters&quo…
By:
Bill Coker
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🇺🇸 United States
Barrel cracks in an accelerated failure mode: reliability i…
By:
Paul Reid
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🇺🇸 United States
Manufacturing in China -- With the promise of a large domes…
By:
E. Jan Vardaman
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🇺🇸 United States
Managing power, a business perspective: complex power distr…
By:
Henry Potts
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🇺🇸 United States
Welcome to the nanotechnology era: get small with carbon na…
By:
Eric Bogatin
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🇺🇸 United States
Automating the documentation process: dedicated tools help …
By:
Mike Buetow
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🇺🇸 United States
What does ESD really cost? Would you believe 4 to 8% of rev…
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🇺🇸 United States
IPC issues ENEPIG specs.: An article from: Printed Circuit …
By:
Unavailable
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🇺🇸 United States
Connecting flex layers using conductive paste: a novel proc…
By:
Mike Buetow
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🇺🇸 United States
Best practices for double-sided mixed-technology boards: be…
By:
George Henning
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🇺🇸 United States
Thermal analysis of base materials through assembly: can cu…
By:
Erik J. Bergum
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🇺🇸 United States
The backbone of circuit connections: a look at how wire har…
By:
Jack Crawford
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🇺🇸 United States
The balancing act: learn how to balance a line using some v…
By:
Phil Zarrow, Jim Hall
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🇺🇸 United States
White Residue: Good or Bad?, Part II -- So, is white residu…
By:
Terry Munson
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🇺🇸 United States
An integrated approach to designing-in FPGAS: FPGA/PCB inte…
By:
Dave Brady
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