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UP Media Group, Inc.
Books by Publisher: UP Media Group, Inc.
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438
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🇺🇸 United States
Buyers beware: there's no free lunch: knowing the ins …
By:
Bruce Archambeault
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🇺🇸 United States
MEMS: a nickel for your thoughts: a novel approach to build…
By:
Noel Cherowbrier
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🇺🇸 United States
PBGA package warpage and impact on traditional MSL classifi…
By:
B.T. Vaccaro, R.L. Shook, E. Thomas, J.J. Gilbert, C. Horvath, A. Dairo, G.J. Libricz
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🇺🇸 United States
Patent spoils.(OUR LINE)(Company overview): An article from…
By:
Kathy Nargi-Toth
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🇺🇸 United States
Clicking your way to a job: sure, it's not that easy. …
By:
Ted Daywalt
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🇺🇸 United States
'One source' fits all: modeled as a "mini Fl…
By:
Andy Shaughnessy, Pete Waddell
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🇺🇸 United States
Improving the multilayer PTFE fabrication process: good dri…
By:
Thomas F. McCarthy, Oliver Zhu, Anthony Serafino, Brigitte Lawrence
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🇺🇸 United States
Leveraging your assets: considerations for shifting to high…
By:
Peter Bollinger, Shawn Robinson
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🇺🇸 United States
PCB directions: don't lose your way. Use these guideli…
By:
Eric Bogatin
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🇺🇸 United States
Back to basics: scratching the surface of surface finishes.…
By:
Don Cullen
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🇺🇸 United States
The future of CAD libraries, Part II: Part of our story abo…
By:
Tom Hausherr
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🇺🇸 United States
The future of CAD libraries: will IPC-7351 be adopted globa…
By:
Tom Hausherr
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🇺🇸 United States
Dump the data.(Our Line): An article from: Printed Circuit …
By:
Mike Buetow
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🇺🇸 United States
Altium reveals 'board-on-chip' technology. (Embed…
By:
Andy Shaughnessy
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🇺🇸 United States
Verifying component authenticity using decapsulation: chemi…
By:
Don Davis
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🇺🇸 United States
Allegro, OrCAD revisions add features, debut hierarchical u…
By:
Mike Buetow
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🇺🇸 United States
Alkalinity doesn't relate to chemical reactivity anymo…
By:
Harald Wack
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🇺🇸 United States
Supply chain collaboration: managing the most-effective sup…
By:
Paul Mounkes
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🇺🇸 United States
OFC 2001 -- Learn as much as you can about photonics -- out…
By:
Jerry Murray
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🇺🇸 United States
A high-bandwidth probing plan: TDR measurements are useful …
By:
Eric Bogatin
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🇺🇸 United States
Designing for power integrity: the proper design of the pow…
By:
Patrick Carrier
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🇺🇸 United States
A matter of timing: gone are the days when chip delays cons…
By:
Matthew Hogan
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🇺🇸 United States
Bridging technology between 3D conventional stacking and TS…
By:
Belgacem Haba
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🇺🇸 United States
Battling ferrite superstition: the right way to use these i…
By:
Eric Bogatin
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🇺🇸 United States
Deterministic jitter: by understanding the relationship bet…
By:
Eric Bogatin
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🇺🇸 United States
Activate that flux! Moisture absorbed by poorly activated f…
By:
Terry Munson
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🇺🇸 United States
POP assembly process fundamentals: an elegant solution to s…
By:
Vern Solberg, Phil Damberg
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🇺🇸 United States
Industry pushes for currency fixes; IPC, USPCA go to DC.(Ma…
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🇺🇸 United States
PCB data preparation; what happens to CAD data once they ar…
By:
Jack Olson, Mike Tucker
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🇺🇸 United States
The brighter side of the industry: now that the recession i…
By:
Dan Beaulieu
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🇺🇸 United States
About that Report Card: while product received may be flawl…
By:
Peter Bigelow
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🇺🇸 United States
About DECs and PCUS: bringing tutorial-level instruction to…
By:
Unavailable
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