Home / Publishers / UP Media Group, Inc.

Books by Publisher: UP Media Group, Inc.

All books from this publisher

12 books found
Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new ... An article from: Circuits Assembly
Used equipment vs. new asking the right questions: dependin…
By: Steve O'Neil
View Details
Making the 'centigrade': how Motorola tested--and approved--a lead-free solder paste.(Cover Story): An article from: Circuits Assembly
Making the 'centigrade': how Motorola tested--and…
By: Vahid Goudarzi, Grahame Freeman
View Details
The search for an ideal lead-free laminate: to make a wise decision, you'll have to understand the fundamental thermal properties of ... from: Printed Circuit Design & Manufacture
The search for an ideal lead-free laminate: to make a wise …
By: Chet Guiles, Ousama Najjar
View Details
Will discoloration tarnish ImAg reliability? Watch for silver embrittlement and corrosion.(Tech Tips): An article from: Circuits Assembly
Will discoloration tarnish ImAg reliability? Watch for silv…
By: Gale Reference Team
View Details
Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront): An article from: Circuits Assembly
Flip chip packaging: a hot topic: flip chip technology appe…
By: E. Jan Vardaman
View Details
The price is right: after a painful 18 months, our latest design industry snapshot shows a picture of improving health (and increasing wealth).(COVER ... An article from: Printed Circuit Design & Fab
The price is right: after a painful 18 months, our latest d…
By: Chelsey Drysdale
View Details
Stub or no stub? Topology analysis can provide optimum system performance.(Interconnect Strategies): An article from: Printed Circuit Design & Manufacture
Stub or no stub? Topology analysis can provide optimum syst…
By: Abe Riazi
View Details
Patent spoils.(OUR LINE)(Company overview): An article from: Printed Circuit Design & Fab
Patent spoils.(OUR LINE)(Company overview): An article from…
By: Kathy Nargi-Toth
View Details
A 'disconnection approach' to cleaning process selection: breaking down cleaning processes into basic building blocks reveals the optimal ... An article from: Printed Circuit Design & Fab
A 'disconnection approach' to cleaning process se…
By: Harald Wack
View Details
Signal integrity applications of Mathcad, Part 2: Mathcad can solve complicated SI expressions including those with complex/ imaginary terms, ... An article from: Printed Circuit Design & Fab
Signal integrity applications of Mathcad, Part 2: Mathcad c…
By: Abe "Abbas" Riazi
View Details
Preventing contamination-caused assembly failure: SIR must be designed for, especially in high-frequency boards.(PROCESS DOCTOR): An article from: Printed Circuit Design & Fab
Preventing contamination-caused assembly failure: SIR must …
By: Harald Wack
View Details
Embedded resistor design guidelines: test vehicle development is continuing, and thermal guideline development has begun.(Getting Embedded): An article from: Printed Circuit Design & Manufacture
Embedded resistor design guidelines: test vehicle developme…
By: Richard C. Snogren, Mike Jouppi
View Details