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| GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance / | |
| Publisher: GENNEL | |
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| Sales Rank: 2205 | |
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Similar Books
* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 10g
Do not use thermal glue between CPU Chip and heatsink
Package Includes:
1 x Thermal Heatsink Plaster Glue.
Now you can buy Books online in USA,UK, India and more than 100 countries.
*Terms and Conditions apply
Disclaimer: All product data on this page belongs to
.
No guarantees are made as to accuracy of prices and information.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 10g
Do not use thermal glue between CPU Chip and heatsink
Package Includes:
1 x Thermal Heatsink Plaster Glue.
Now you can buy Books online in USA,UK, India and more than 100 countries.
*Terms and Conditions apply
Disclaimer: All product data on this page belongs to
.No guarantees are made as to accuracy of prices and information.
